Researchers Develop Eco-Friendly Foam Materials Without PFAS and Titanium Dioxide
An international team of scientists has engineered a new foam-based materials platform that achieves structural whiteness and water repellency. The innovative manufacturing method operates without harmful substances like titanium dioxide or PFAS.

An international research team has successfully engineered an advanced foam-based materials platform that utilizes structural whiteness and water-repellent properties. The breakthrough development was achieved without relying on traditional additives such as titanium dioxide or harmful per- and polyfluoroalkyl substances, commonly known as PFAS.
The collaborative scientific effort was led by Professor Easan Sivaniah of Kyoto University. The research group also included prominent academic contributors from Tokyo Metropolitan University and Donghua University, bringing together multidisciplinary expertise to tackle longstanding environmental challenges in material science.
Addressing the broader implications of the discovery, researcher Taiki Yanagishima noted the persistent hurdles in the field. “A key challenge faced by biomimetic science is realizing environmentally friendly material designs inspired by nature at the scale and cost of existing materials,” Yanagishima explained regarding the motivation behind the research.
To overcome these manufacturing hurdles, the team devised a novel production technique. The method involves exposing a specific polymer to light and subsequently treating it with a mild solvent. This precise chemical and physical treatment causes the polymer to swell and ultimately develop an open network of microscopic pores designed to imitate natural foams that effectively scatter light and repel water.
Crucially, the newly developed manufacturing process is compatible with readily available industrial supplies. The method works successfully on commercially available polymers and can be applied directly to both printable polymer films and various fabrics. Furthermore, the innovative technique achieves an exceptionally high resolution of 20,000 DPI, highlighting its potential for precision applications.






